KLA Corporation develops advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. Their wafer processing technologies for MEMS manufacturing include SPTS etch and deposition solutions; Si DRIE for MEMS micromachining, ICP etch, vapor release etch (HF or XeF2) for MEMS release, low temperature PECVD, PVD and MVD.